Semiconductor device with wettable corner leads
US9847283B1 · kind B1 · utility
6Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2016 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Nov 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has wettable corner leads. A semiconductor die is mounted on a lead frame. Die bonding pads are electrically connected to leads of the lead frame. The die and electrical connections are encapsulated with a mold compound. The leads are exposed and flush with the corners of the device. The leads include dimples so that they are wettable, which facilitates inspection when the device is mounted on a circuit board or substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.