Light emitting device with molded wavelength converting layer
US9847465B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 4, 2014 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Aug 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.