Manufacturing automation of in-situ temperature compensation information
US9847752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2016 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Apr 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L1/02
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An in-situ temperature compensation method of an electronic device and an associated temperature sensor includes providing airflow from a vortex air gun to a board including the electronic device and the associated temperature sensor; determining an associated offset at various temperatures in an operating range; and creating and storing a calibration table in memory including the associated offsets at the various temperatures, the calibration table is used during operation of the electronic device for compensation due to temperature variation. A system includes a board, an electronic device disposed to the board; a temperature sensor disposed on the board; a processor disposed to the board and communicatively coupled to the electronic device and the temperature sensor; and instructions that cause the processor to determine an associated offset at various temperatures in an operating range, and create and store a calibration table in memory with the associated offsets at the various temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.