Heat sink module
US9848509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2015 |
| Grant date | Dec 19, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F13/02
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.