Patent · US Active

Laser-supported plasma processing

US9849545B2 · kind B2 · utility

1Cited by

6References

22Claims

0Family size

Assignee

TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

Andreas Popp · Ludwigshafen, DE
Tim Hesse · Ditzingen, DE
Tobias Kaiser · Rutesheim, DE

Key dates

Filing date	Oct 29, 2014
Grant date	Dec 26, 2017
Priority date	—
Expiry date	Aug 11, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/348
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Methods, devices and systems for laser-supported plasma cutting or plasma welding of a workpiece. In one aspect, a method includes producing a plasma beam which extends in an expansion direction between an electrode and a processing location on the workpiece, the plasma beam having, with respect to a center axis of the plasma beam that extends in the expansion direction, an inner central region and an outer edge region, and supplying laser radiation to the outer edge region of the plasma beam. The laser radiation supplied to the outer edge region extends parallel with the center axis of the plasma beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.