Packaging structure for packing substrate storing container
US9850055B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2013 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Dec 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67376
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The first cushioning portion includes: a cushioning support portion that directly abuts the substrate storing container to support the substrate storing container; and a cushioning-portion connecting portion that is connected to the cushioning support portion, and extends downwards from the cushioning support portion. The second cushioning portion includes: a cushioning plate-like portion in which a through-hole is formed; and cushioning leg portions which are configured by a cushioning material which is softer than the cushioning-portion connecting portion of the first cushioning portion, and extend downwards from the cushioning plate-like portion. The cushioning plate-like portion supports the first cushioning portion in a state in which the cushioning-portion connecting portion penetrates through the through-hole of the cushioning plate-like portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.