Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film
US9850347B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2013 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Oct 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31623
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.