Patent · US Active

Use of an adhesive composition to provide a bonding in a wet environment

US9850411B2 · kind B2 · utility

4Cited by
3References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 5, 2013
Grant dateDec 26, 2017
Priority date
Expiry dateAug 19, 2034

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2400/22
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.