Aqueous working fluid
US9850443B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 5, 2014 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Mar 5, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2040/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A water-soluble working fluid of the invention is used for cutting a brittle material using a wire saw. The water-soluble working fluid is provided by blending water, alkylene oxide adduct of acethylene glycol, and glycols. The water-soluble working fluid of the invention is capable of providing favorable cutting accuracy when the brittle material is cut using a wire, and thus is suitable for cutting out a large-diameter wafer. The water-soluble working fluid of the invention is especially suitably applicable to an abrasive-grain-fixed wire saw.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.