Optical communication component cooling
US9851520B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Inventors
Key dates
| Filing date | Apr 22, 2016 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Apr 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02415
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical communication package includes a circuit layer, an optical component electrically coupled to the circuit layer to optically communicate outside of the package, and a thermoelectric cooler electrically coupled to the circuit layer and disposed to transfer heat from the optical component to the circuit layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.