Microprocessor assembly adapted for fluid cooling
US9852963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2015 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Jan 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.