Patent · US Active

Electronic component, electronic apparatus, and method of manufacturing electronic apparatus

US9853014B2 · kind B2 · utility

0Cited by

6References

19Claims

0Family size

Assignee

FUJITSU LIMITED · JP

Inventors

Ryo Kikuchi · Musashino, JP
Nobuhiro Imaizumi · Shizuoka, JP
Hiroshi Onuki · Hitachinaka, JP

Key dates

Filing date	Sep 26, 2016
Grant date	Dec 26, 2017
Priority date	—
Expiry date	Sep 26, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/35121
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.