Interconnect devices having a biplanar connection
US9853402B2 · kind B2 · utility
8Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2016 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | May 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R25/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.