Imaging unit including a chassis and heat transfer member
US9854225B2 · kind B2 · utility
5Cited by
19References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2015 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Jan 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2213/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An imaging unit includes a plurality of imaging devices configured to capture images of an object; a circuit substrate configured to generate image data based on the images captured by the imaging devices; a chassis that holds the imaging devices; and a heat transfer member including a contacting portion configured to contact an installed member in a case where the imaging unit is installed on the installed member. The heat transfer member contacts the chassis or the circuit substrate, and heat conductivity of the heat transfer member is greater than the heat conductivity of the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.