Flexible printed circuit and printed circuit board soldered structure
US9854674B1 · kind B1 · utility
2Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2017 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09263
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.