Flexible two-phase cooling system
US9854715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2015 |
| Grant date | Dec 26, 2017 |
| Priority date | — |
| Expiry date | Jan 5, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D2021/0029
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.