Fluid ejection head and process for making a fluid ejection head structure
US9855566B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2016 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Oct 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/883
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection head and a method of making a fluid ejection head. The method includes providing a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof. The substrate is reactive ion etched to form one or more fluid supply vias therein. A flow feature layer is laminated to the substrate and is exposed to ultra violet (UV) radiation through a photo mask to provide UV exposed areas of the flow feature layer. The flow feature layer is heated to cross-link material in the UV exposed areas. A nozzle plate layer is laminated to the flow feature layer and exposed to UV radiation through a photo mask to provide UV exposed areas for nozzle holes. The nozzle plate layer is cross-linked with heat and the flow feature layer and nozzle plate layer are developed to form the flow features and nozzle holes in the respective layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.