System and method for high power diode based additive manufacturing
US9855625B2 · kind B2 · utility
31Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2016 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | May 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A system is disclosed for performing an Additive Manufacturing (AM) fabrication process on a powdered material forming a substrate. The system may make use of a diode array for generating an optical signal sufficient to melt a powdered material of the substrate. A mask may be used for preventing a first predetermined portion of the optical signal from reaching the substrate, while allowing a second predetermined portion to reach the substrate. At least one processor may be used for controlling an output of the diode array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.