Spring clips for mounting optics structures on an associated circuit board, and assemblies including the spring clips
US9857554B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Mar 17, 2016 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Mar 17, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B7/023
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Clips are provided to secure optic element systems to a printed circuit board. Associated mounting systems may, for example, eliminate direct adhesion of an optic element to an associated illumination source (e.g., LED). Thereby, thermal management of the system may be improved, adding flexibility in, for example, mounting height and tilt of an optic element. Thus, manufacturing cost, associated with mounting optic elements to L.E.D. arrays, may be reduced. Associated mounting systems may enable a direct electrical connection from a printed circuit to, for example, optical path control elements embedded within an optic element using, for example, various electro-optical control technologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.