Method of manufacturing substrate and substrate and mask film
US9857687B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
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Key dates
| Filing date | Feb 26, 2014 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Feb 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0571
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.