Memory module having different types of memory mounted together thereon, and information processing device having memory module mounted therein
US9858181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2013 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jan 11, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2212/7201
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.