Packaging for high-power microwave module

US9859178B2 · kind B2 · utility

Assignee

• BAE Systems Information and Electronic Systems Integration Inc. · US

Inventors

• Yannick C. Morel · Falls Church, US
• Sheila J. Konecke · Leesburg, US
• Santos Nazario-Camacho · Culpeper, US
• Clint J. Novotny · Washington, US
• Keith K. Sturcken · Nokesville, US

Key dates

• Filing date: Oct 7, 2015
• Grant date: Jan 2, 2018
• Expiry date: Jan 18, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microwave module is described. The microwave module includes a base bracket, a window plate and a lid. The base bracket is configured to contain a photoconductive switch, a radio-frequency transformer and dielectric oil. The window plate, which is transparent to optical light, covers a first portion of the base bracket in which the photoconductive switch is located. The window plate is sealed to the base bracket. The lid, which includes a cutout to allow the radio-frequency transformer to pass through the lid, covers a second portion of the base bracket in which the radio-frequency transformer is located. The window plate is sealed to the base bracket, and the lid is sealed to the window plate, the base bracket and the radio-frequency transformer to contain the dielectric oil within the microwave module.