Substrate and the method to fabricate thereof
US9859250B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2014 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Sep 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.