Stacked chip microphone
US9860623B1 · kind B1 · utility
3Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2016 |
| Grant date | Jan 2, 2018 |
| Priority date | — |
| Expiry date | Jul 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.