Reduced wire profile stent
US9861506B2 · kind B2 · utility
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11References
9Claims
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Assignee
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Key dates
| Filing date | Mar 28, 2016 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Mar 28, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2250/0039
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.