Short pulse laser machining of polymers enhanced with light absorbers for fabricating medical devices
US9861508B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Jan 4, 2017 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jan 4, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7532
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of laser machining a polymer construct to form a stent that includes a bioresorbable polymer and an absorber that increases absorption of laser energy during laser machining. The laser cuts the tubing at least in part by a multiphoton absorption mechanism and the polymer and absorber have a very low absorbance or are transparent to light at the laser wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.