Substrate-based additive fabrication process and apparatus
US9862146B2 · kind B2 · utility
33Cited by
1References
19Claims
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Key dates
| Filing date | Jun 15, 2012 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Dec 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for additive fabrication which provides a substrate which helps the newly hardened resin layer to separate from the substrate while providing a substrate of appropriate strength and durability. In an embodiment, the substrate is a multi-layer substrate comprising a transport layer and a structural layer, the transport layer comprising a polyolefin or a fluoropolymer, and the structural layer comprising a semi-crystal line thermoplastic polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.