Thermally-conductive polycarbonate resin composition and molded product formed therefrom
US9862870B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
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Key dates
| Filing date | Dec 2, 2013 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Dec 2, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a thermally conductive polycarbonate resin composition comprising (A) a polycarbonate resin, (B) a thermally conductive filler, (C) a modified polyolefin-based copolymer and (D) a low-molecular-weight polyolefin-based resin, thereby simultaneously exhibiting high impact strength, improving thermal conductivity and mechanical properties such as tensile strength and elongation, and having an excellent extrusion molding property.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.