Deposition mask and method of fabricating the same
US9863037B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2015 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Sep 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32623
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition mask comprises a mask body comprising a plurality of through holes; and a deposition layer formed on external surfaces of the mask body. A method of manufacturing a deposition mask comprises: installing a deposition mask body in a chamber; forming a magnetic field between a plurality of magnet units within the chamber, wherein the deposition mask body is disposed between the magnet units; and applying voltages to first and second sputtering targets comprising a material to generate electric discharge such that particles of the material are sputtered from the first and second sputtering targets and deposited on the deposition mask body, thereby making a deposition mask with a layer of the material. The voltages having different magnitudes are applied to the first and second sputtering targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.