Processing apparatus and processing method
US9865470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2016 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jul 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus includes a rotary table that causes a workpiece to rotate around a rotary axis, a roller-shaped member that rotates on an axis orthogonal to the rotary axis of the rotary table, a vertical driving section that is driven in a direction of the rotary axis of the rotary table so as to bring the roller-shaped member and the workpiece into contact with each other, an ultraviolet ray irradiation source that irradiates a portion between the roller-shaped member and the workpiece with an ultraviolet ray, a polishing material that is supplied to the portion between the roller-shaped member and the workpiece, and a light scattering medium that is supplied to the portion between the roller-shaped member and the workpiece and scatters an ultraviolet ray from the ultraviolet ray irradiation source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.