Method for manufacturing stretchable wire and method for manufacturing stretchable integrated circuit
US9865559B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jul 26, 2016 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jul 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.