Patent · US Active

Optoelectronic component and method of production thereof

US9865785B2 · kind B2 · utility

0Cited by

0References

13Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Andreas Gruendl · Starnberg, DE
Tobias Gebuhr · Regensburg, DE
Markus Pindl · Tegernheim, DE

Key dates

Filing date	Nov 28, 2014
Grant date	Jan 9, 2018
Priority date	—
Expiry date	Nov 28, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.