Packaging for an electronic device

US9865807B2 · kind B2 · utility

Assignee

• Allegro MicroSystems, LLC · US

Inventors

• Shixi Louis Liu · Milpitas, US
• Harianto Wong · Southborough, US
• Paul A. David · Bow, US
• John Sauber · Millbury, US
• Shaun D. Milano · Dunbarton, US
• Raguvir Kanda · Attleboro, US
• Bruce Hemenway · Milford, US

Key dates

• Filing date: Oct 7, 2015
• Grant date: Jan 9, 2018
• Expiry date: Jan 2, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15162
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.