Electronic device with diverse antenna array having soldered connections
US9865915B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2013 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | May 14, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wireless electronic device may be provided with antenna structures. The antenna structures may be formed from an antenna ground and an array of antenna resonating elements. The antenna resonating elements may be electrically connected to the antenna ground using solder. The antenna resonating elements may be formed from metal traces on a dielectric support structure that surrounds the antenna ground. The antenna ground may be formed form stamped sheet metal and may have slanted steps adjacent to the antenna resonating elements. To form a solder joint between the metal antenna resonating element traces and the sheet metal of the antenna ground, laser light may be applied to the sheet metal of the antenna ground in the vicinity of the solder paste. Separate metal members may also be provided in the vicinity of the solder paste and may be heated using the laser to join metal traces on plastic carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.