Modular power supply and method for manufacturing the same
US9867275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2016 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jun 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular power supply and a method for manufacturing the same are disclosed. The modular power supply comprises a printed circuit board, power components, and a heat sink. The power components are mounted on the printed circuit board and disposed at a side opposite to the heat sink, a lower surface of the printed circuit board is engaged with an upper surface of the heat sink which is planar, and an insulating layer is disposed between the upper surface of the heat sink and the lower surface of the printed circuit board. A method for manufacturing the modular power supply is also disclosed. The modular power supply has excellent heat dissipation effect, and the production and assembly process thereof is simplified, so that the production efficiency is improved and the quality is guaranteed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.