Patent · US Active

Circuit board comprising an insulating diamond material

US9867286B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignees

Inventors

Key dates

Filing dateJun 25, 2014
Grant dateJan 9, 2018
Priority date
Expiry dateJun 25, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/0376
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.