Circuit board comprising an insulating diamond material
US9867286B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 25, 2014 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0376
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.