Printed circuit board and package substrate
US9867296B2 · kind B2 · utility
2Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Jan 9, 2018 |
| Priority date | — |
| Expiry date | Jan 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1383
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes an insulating substrate, a plurality of pads on a top surface of the insulating substrate, a protective layer formed on the insulating substrate and having an opening to expose top surfaces of the pads, a bump formed on at least one of the pads and protruding upward of a surface of the protective layer. The bump has a curved lateral side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.