Die for depositing at least one conductive fluid onto a substrate, and device including such a matrix and deposition method
US9868132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2013 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Jun 3, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a die for depositing a conductive fluid onto a substrate, including a structure (11) for supporting at least one fluid (13) which is conductive and the viscosity of which sensitive to the radiation from a light source (5), in order to deposit said fluid (13) onto a substrate (3) so as to form conductive contacts or tracks on the substrate (3). The support structure (11) includes at least one tank (17) for said conductive fluid, the bottom wall (19) of which is to be arranged opposite said substrate (3) during the deposition, and said bottom wall (19) has perforations for enabling the flow (18) of said conductive fluid (13) onto the substrate (3) when said fluid (13) is subjected to the radiation (15) from said light source (5), wherein the perforations are formed according to a pattern of the fluid to be deposited onto the substrate (3). The die (7) further comprises an optical plate (9) having a pattern (30) pervious to the radiation from said light source (5), the optical plate (9) being impervious to the radiation from said light source (5) outside said pattern (30), while the pattern (30) pervious to the radiation from said light source on said optical …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.