Low-density molding compound containing surface derivatized microspheres
US9868829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/003
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molded article is provided that includes a resin matrix having a surface, the resin matrix formed from cross-linked polyester resin or vinyl-ester resin. Microspheroids having a mean diameter of from 16 to 45 microns are embedded in the resin matrix. The microspheroids having a specific gravity of between 0.19 and 0.6 and an isotactic crush strength of greater than or equal to 2750 kilopascals (kPa). Surface activating agent alkoxysilane molecules are covalently bonded to each of the microspheroids. Filler particles are also present in the resin matrix. Fibers are also present in the resin matrix. The fibers being natural fibers, glass fibers, carbon fibers, or a combination thereof. The article has a specific gravity of between 0.80 and 1.25.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.