Electroless copper plating compositions
US9869026B2 · kind B2 · utility
0Cited by
9References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 15, 2014 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Jul 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/422
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.