Patent · US Active

Composition for metal plating comprising suppressing agent for void free submicron feature filling

US9869029B2 · kind B2 · utility

3Cited by

5References

22Claims

0Family size

Assignee

BASF SE

Inventors

Cornelia Roeger-Goepfert · Weinheim, DE
Roman Benedikt Raether · Speyer, DE
Alexandra Haag · Ludwigshafen, DE
Dieter Mayer · Ludwigshafen, DE
Charlotte Emnet · Bad Dürkheim, DE

Key dates

Filing date	Jul 16, 2010
Grant date	Jan 16, 2018
Priority date	—
Expiry date	Jul 25, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH05K3/42
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

According to the present invention a composition is provided comprising at least one source of metal ions and at least one additive obtainable by reacting a) a polyhydric alcohol condensate compound derived from at least one polyalcohol of formula (I)X(OH)n (I)by condensation with b) at least one alkylene oxide to form a polyhydric alcohol condensate comprising polyoxyalkylene side chains, wherein n is an integer from 3 to 6 and X is an n-valent linear or branched aliphatic or cycloaliphatic radical having from 2 to 10 carbon atoms, which may be substituted or unsubstituted.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.