Thermo-compression head, soldering system, and LED tube lamp
US9869431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Oct 20, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermo-compression head, a soldering system, and a LED tube lamp are disclosed. The thermo-compression head includes a bonding plane, a restraining plane, one or more concave guiding tank, and one or more concave molding tank. The bonding plane is for touching a second object. The restraining plane is adjacent to the bonding plane for touching a first object soldered to the second object. The concave guiding tank is formed on the bonding plane. An end of the concave guiding tank is opened near an edge of the bonding plane while an opposite end of the concave guiding tank is closed. The concave molding tank is formed on the restraining plane and positioned beside the concave guiding tank. The concave molding tank communicates with the concave guiding tank via the open end of the concave guiding tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.