Touch device structure having through holes
US9870072B2 · kind B2 · utility
2Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Apr 16, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04104
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A digitizer includes a first substrate, a first electrode on the first substrate, a first insulating layer on the first electrode, and a second electrode on the first insulating layer. The first insulating layer is formed therein with a through hole to expose the first electrode, and the first and second electrodes make contact with each other through the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.