Electrical and thermal conductive paste composition and method of reducing percolation threshold and enhancing percolating conductivity using the same
US9870843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2383/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An electrical and thermal conductive paste composition includes a wetting agent that is arranged as a conduction promoter. Further, a method produces an electrical and thermal conductive paste composition by using a wetting agent as a conduction promoter or a conductivity promoter. The electrical and thermal conductivity of a conductive particle-filled polymer composite is enhanced by using the wetting agent. Capillary forces exerted by the wetting agent cause a particle-filled polymeric suspension to percolate at a decreased volume fraction into a highly conductive network and enhance the conductivity of the composite. Through a jamming gelation technique, the percolation threshold in the particle filled polymer composite is lowered to as low as 3 volume percent. As a result, the electrical and thermal conductivity of the composite is maintained at a significantly lower filler volume fraction with a reduction of particle filler content of up to 50 weight percent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.