Method for collective (wafer-scale) fabrication of electronic devices and electronic device
US9870947B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 26, 2017 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Jun 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic devices are manufactured using a collective (wafer-scale) fabrication process. Electronic chips are mounted onto one face of a collective substrate wafer. A collective flexible sheet made of a heat-conductive material comprising a layer containing pyrolytic graphite is fixed to extend over a collective region extending over the electronic chips and over the collective substrate wafer between the electronic chips. The collective flexible sheet is then compressed. A dicing operation is then carried out in order to obtain electronic devices each including an electronic chip, a portion of the collective plate and a portion of the collective flexible sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.