Via density in radio frequency shielding applications
US9871599B2 · kind B2 · utility
27Cited by
41References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2015 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09618
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.