Methods of sewing components in fabrics using metal wire cloth
US9872383B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2014 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Jun 19, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.