Flexible interconnect
US9872390B1 · kind B1 · utility
5Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Jan 16, 2018 |
| Priority date | — |
| Expiry date | Aug 17, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1305
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.