Systems and methods for manufacturing diamond coated wires
US9873159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2015 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Dec 30, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.