Abrasive material, method for producing same, and abrasive slurry containing same
US9873824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Jan 23, 2018 |
| Priority date | — |
| Expiry date | Aug 29, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01P2004/84
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing material including polishing abrasive grains, the polishing abrasive grain having a core material that includes a metal oxide, and a cover layer that is provided on a surface of the core material and includes an oxide of a metal, that is different from the core material, or an oxide of a semimetal. When the polishing abrasive grains are observed with a scanning electron microscope after boiling a slurry including the polishing abrasive grains for 5 hours, a ratio of a longitudinal axis to a lateral axis of the polishing abrasive grain is 1.0 or greater and less than 1.5. The polishing abrasive grain preferably has a mass ratio of the cover layer to the core material, cover layer/core material, of from 0.3 mass % to 30 mass % inclusive. The cover layer preferably has a thickness of from 0.2 nm to 500 nm inclusive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.